Here are some of the key features Spherical Quartz Powder
Smooth surface, high specific area and chemical stability are some of the benefits that spherical Quartz powder offers. Spherical quartz powder exhibits good fluidity and is mixed well with the resin in order to form a thin film. A higher amount of quartz powder is better for electronic components. It will also have a lower thermal conductivity. Also, the mold compound has a smaller thermal expansion factor. The stress of spherical granules is 60% less than the stress of an angular one. Furthermore, the highest stress concentrations and greatest strength are found in the molding compound that has been made with spherical particles of quartz. The surface texture of spherical quartz powder is extremely smooth. It has low friction and wear, which may extend its service life by up to one-third.
Spherical Quartz Powder Spherical SiO2 Property | |
Other Titles | Fused quartz, spherial quartz, spherical SiO2, silica |
7631-86-9 | |
Compound Formula | SiO2 |
Molecular Weight | 60.09 |
Appearance | Powder White |
Melting Point | 1,600deg C (2,912deg F) |
Solubility In Water | N/A |
Density | 2533 kg/m3 |
Purity | 99.5-99.9% |
Particle Size | 10-30nm |
Boling point | 2,230deg C (4,046deg F) |
Specific Heat | N/A |
Thermo Conductivity | N/A |
Thermal Expansion | N/A |
Young’s Module | N/A |
Exact | 59.9668 g/mol |
Monoisotopic | 59.967 D |
There are many uses for spherical powdered quartz, with electronic packaging being the most popular. The support industry of integrated circuits, electronic packaging, is what makes up the bulk of its market. As integrated circuits become increasingly sophisticated, the demands for packaging materials increase. Packaging forms are continually optimized and improved to meet these requirements. Three main types of electronic packaging include substrate, plastic, glue, and frame. The advantages of plastic packaging include its ease-of-use, low cost and ability to be made in mass quantities. Plastic packaging is responsible for approximately 95% of all integrated circuits worldwide. %above. EMC is the main plastic encapsulant. It houses more than 95% microelectronic component.
1. Microelectronic packaging must be able to withstand high humidity, low stress, dip and reflow welding resistances, as well as good sealing properties. To address this issue, epoxy molding compounds must contain inorganic fillers. Inorganic fillers are used almost exclusively in quartz micropowder, also known as silicon micropowder. Large-scale, ultra-large-scale microelectronics circuits now have more stringent requirements for packaging material. EMC powder, which is essential for supporting EMC technology, requires quartz powder to be of the required particle size. Quartz powder also needs its purity.
2. It is a sphere of high quality silicon micropowder that has a good form and is low in radioactive elements. This allows it to meet the technical needs of high-end integrated systems. This can reduce the temperature expansion coefficient, dielectric constant, and stress of sealing materials. The products also have excellent weather resistance, impact resistance and compression resistance. Aside from being used in electronic packaging, the spherical Quartz powder can be extensively used in manufacturing electronic inks.
The principal supplier Spherical Quartz Powder
Luoyang Tech Co., Ltd. is a company that specializes in professional IT services. oxide powder Over 12 years’ experience in developing and researching chemical products. You can pay by Credit Card, T/T or West Union. We will send the items to overseas customers via FedEx or DHL.
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