Silicon Nitride’s main features
The relative molecular weight is 140.28. You can choose from grey, white, or off-white. It is high temperature insoluble, has no melting points, and has strong resistance to high temperatures creep. The melting point of reaction sintered silicone nitride is over 1800°C; hexagonal system. The crystals are hexahedral. Si3N4 prepared through reaction sintering methods has a density of 1.82.7g/cm3, while Si3N4 made by hot pressing methods has a density of 3.123.22g/cm3. Mohs hardness 9.9, Vickers hardness 2.20, and microhardness 3.123.22g/cm3 are the Mohs and Vickers hardness. Melting point 1900 (under pressure). Normal pressure usually causes it to decompose at around 1900°C. Specific heat capacity 0.71J/g*K The heat of forming is -751.57kJ/mol. Thermal conductivity is 2-155 W/(m*K). The coefficient of linear expansion is 2.8~3.2×10-6/(20~1000). It is not soluble when water is used. Hydrofluoric Acid makes it soluble. The temperature at the which oxygenation occurs in the air is 1300-1400. The specific volume resistance of the air is 1.4×105 *m for 20degC, and 4×108 *m for 500degC. The elastic modulus measures 2842046060MPa. The reaction sintered results in a 490MPa compressive force. At 1285, it reacts to dicalcium dinitride, forming calcium silicide. And at 600, the transitional metal is reduced and nitrogen oxides released. It has a bending strength of 147 MPa. It can be made by heating silicon powder with nitrogen or reacting silica halide in ammonia. The resistance is between 10 and 15 to 16 O.cm. Useful for high temperature ceramic raw materials.
Silicon Nitride Properties | |
Other Titles | silicon (IV), nitride |
No. | 12033-89-5 |
Combination Formula | Si3N4 |
Molecular Weight | 140.28 |
Appearance | White powder to gray powder |
Melting Point | 1900 degC |
Boiling Point | N/A |
Density | 2.2-3.5 g/cm3 |
Solubility of H2O | Insoluble |
Electrical Resistivity | 11 to 12 10x O.m |
Specific heat | 720 to 800 J/kg – K |
Poisson’s Ratio | 0.24 to $0.27 |
Thermal Conductivity | 12 to 31 W/m/K |
Thermal Expansion | 2.5 to 3.0 um/m-K |
Young’s Modulus | 140 to 315 GPa |
Exact | 139.943 g/mol |
1. High thermal stability, high oxidation resistance and high product dimensional accuracy are all characteristics of silicon nitride ceramics. Silicon nitride, a covalent chemical compound, has a high bond strength and can form oxidation protective films in the air. It also has excellent chemical stability. It is resistant to oxidization and can be infiltrated or damaged by many molten metals and alloys, including aluminum, lead, zinc, silver, nickel, etc. But it can also be corroded from molten liquids, such as magnesium and nickel-chromium alliance, as well as stainless steel. Silicon nitride ceramic materials are used for high temperature engineering components, advanced materials in metallurgical industries, corrosion-resistant parts and sealing components in chemical industries, as well cutting tools and tools in the machining industry.
Because silicon nitride forms strong bonds with aluminum oxide, silicon carbide, silicon carbide, thorium dioxide, boron and thorium dioxide it can be used to modify different ratios.
2. Also, solar cells can be made from silicon nitride. After the silicon-nitride coating is applied using the PECVD method it can be used as an antireflection film to reduce reflections of incident light. During the deposition of the silicon silicon nitride movie, hydrogen atoms from the reaction product enter both the silicon film and the silicon wafer. This role was to prevent passivation. Here, the atomic ratio of silicon Nitride to silicon Nitride is not exactly 4:3. It fluctuates between different process conditions and different physical properties.
3. Ultra-high temperatures gas turbines, aircraft engines and electric furnaces are all suitable.
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